IMPACT OF UNDERFILL AND SOLDER JOINT ALLOY SELECTION ON FLIP CHIP SOLDER JOINT RELIABILITYAuthors: Dave Hillman and Ross Wilcoxon
Company: Rockwell Collins, Inc.
Date Published: 9/26/2004 Conference: SMTA International
Components with Hysol® FP4527 were only slightly less reliable than those with Loctite® 3568. The results indicate that the Pb-free solder evaluated in this study would not be suitable for Rockwell Collins applications, using present materials and process parameters. On the other hand, this flip chip device with eutectic solder joints and the reworkable Loctite® 3568 underfill completed more than 1000 thermal cycles without failure and therefore is considered to be suitable, per Rockwell Collins standards, for ground-based military and commercial avionics systems.
Key Words: Flip Chip, reliability, thermal cycle testing, underfill, lead free
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