BOARD LEVEL RELIABILITY OF QFP AND QFN TYPE PACKAGES WITH MATTE SN LEAD FINISHAuthor: Ahmer Syed et al.
Company: Amkor Technology, Inc.
Date Published: 9/26/2004 Conference: SMTA International
Comparisons with SnPb and SnBi finish packages are also provided. The test matrix includes the following:
The board assemblies were tested using lead pull, temperature cycling, and drop conditions. The data shows the packages with Matte Sn finish perform as good or better than packages with SnPb finish during board level testing.
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