SMTA International Conference Proceedings


BOARD LEVEL RELIABILITY OF QFP AND QFN TYPE PACKAGES WITH MATTE SN LEAD FINISH

Author: Ahmer Syed et al.
Company: Amkor Technology, Inc.
Date Published: 9/26/2004   Conference: SMTA International


Abstract: Matte Sn, along with NiPdAu and SnBi, is in consideration to replace SnPb as the lead finish for lead-frame based IC packages for Pb free assemblies. Board level reliability of packages with this finish is an important aspect in selecting any lead finish. This paper reports data on the solder joint reliability of leaded (TQFP, TSOP) and leadless (MLF) packages with matte Sn finish.

Comparisons with SnPb and SnBi finish packages are also provided. The test matrix includes the following:

  • 3 package types (14x14mm TQFP, 12x20mm TSOP, and 7x7mm MLF)
  • 3 lead finishes (Matte Sn, SnPb, and SnBi),
  • 2 leadframe materials (Alloy 42 and copper), and
  • 3 solder pastes (SnPb and 2 versions of SnAgCu) for board assembly.
  • The board assemblies were tested using lead pull, temperature cycling, and drop conditions. The data shows the packages with Matte Sn finish perform as good or better than packages with SnPb finish during board level testing.



    Members download articles for free:

    Not a member yet?

    What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

    Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


    Back


    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone +1 952.920.7682
    Fax +1 952.926.1819