EFFECT OF THE REFLOW PROFILE ON BGA VOIDING IN A LEAD-FREE PROCESSAuthors: Felix Bruno and Frank Grano et al.
Company: Sanmina-SCI Tech. Dvpmt. Ctr.
Date Published: 9/26/2004 Conference: SMTA International
The formation of voids can be attributed to different process parameters - surface contamination and moisture absorption in BGAs and Printed Circuit Boards (PCBs), solder paste & operating conditions and reflow profiles - to mention a few. Among these, the reflow profile is one of the very critical parameters in electronics manufacturing.
Several experiments have been conducted in the past to study the impact of reflow profile. In addition, the electronics manufacturing industry is gradually moving towards a lead-free environment. This has resulted in higher peak temperatures for the reflow profiles. However, with higher peak temperatures, the other reflow parameters also have to be varied. An optimum range for all the reflow parameters would reduce (or even eliminate) the formation of solder voids.
This paper investigates the impact of the reflow profile on the quality of the lead-free surface mount solder joint. In particular, the impact of the reflow profile on solder joint voiding for lead-free assemblies is analyzed. The critical reflow profile parameters that are responsible for voiding such as preheat temperature, ramp-up rate, and peak temperature were varied within the allowable process limits to verify if the voiding could be minimized. Ball Grid Arrays (BGAs) were assembled using varying reflow profiles. The analysis involved x-ray examination to observe the formation of solder voids.
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