SMTA International Conference Proceedings


EFFECT OF SOLDER PASTE VOLUME ON THERMOMECHANICAL RELIABILTY

Authors: Chris Achong and Dennis Krizman
Company: Celestica International Inc.
Date Published: 9/26/2004   Conference: SMTA International


Abstract: Solder paste deposition is a key aspect in the manufacturing assembly of electronics. A significant number of board assembly related defects can be attributed to the solder paste deposition process. A consistent solder paste deposition process promotes a smooth manufacturing assembly process and can address coplanarity anomalies in components used in SMT. It is postulated that solder joint reliability is dependent on a number of factors including solder paste volume.

Unfortunately there is little empirical data published (available) to substantiate this claim. To address this need this paper investigates the effect of the volume of solder paste deposited on the reliability of the resulting solder joints after reflow. Thermomechanical testing (accelerated thermal cycling) was used to determine the cycles to failure for a number of area array components with eutectic tin-lead balls ranging in pitch from 1.0 mm to 0.5 mm.

Included in this investigation were two cases where BGA and LGA versions of the same component were compared. Solder paste volume was measured using a 3D automated laser inspection tool across all pads on each component type. The effect of natural variation in solder volume on cycles to failure was studied and for 0.5 mm pitch components the effect of two aperture designs was determined.

The investigation was performed as part of a larger initiative to determine the manufacturability and reliability of a number of unique area array packages assembled on a simulated mixed technology test vehicle named Millennium Olivia TV2.

Key words: Reliability, Solder Paste Volume



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