SMTA International Conference Proceedings


Authors: Dennis Krizman, Chris Achong, Scott Waters
Company: Celestica International Inc.
Date Published: 9/26/2004   Conference: SMTA International

Abstract: The application of fine pitch packaging in the electronics industry has grown significantly in the past several years. A number of studies have focused on optimization of design and assembly process variables, however the contribution of these factors to solder joint reliability is not as clearly understood.

A study has been undertaken to evaluate the robustness of assembly processes and the solder joint reliability of a test vehicle platform containing thirty-one unique fine-pitch packages. One goal was to evaluate a wide variety of commercially available fine pitch packaging technologies on a test vehicle platform that is representative of a mixed technology production assembly.

A second goal was to evaluate the impact of a variety of experimental factors on the thermo-mechanical reliability of the packages under test. Specific experimental factors included the effect of board thickness; the effect of surface finish; the effect of pad size; and the effect of component overlap (mirror image).

Taguchi methods were used to evaluate the significance of each of these factors on the reliability of these packages. Specific component reliability comparisons were made comparing the reliability of land grid array (LGA) vs. ball grid array (BGA) packages. Failure analysis was completed to identify the failure modes of these components in the study.

Key Words: Area Array, Fine Pitch Packaging, Reliability

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