SMTA International Conference Proceedings


REWORK EQUIPMENT: LASER VERSUS HOT GAS COMPARISON

Authors: John Davis, Charlie Fieselman, Kris Slesinger
Company: Solectron Technology, Inc.
Date Published: 9/26/2004   Conference: SMTA International


Abstract: The advantages and benefits of laser soldering systems have been discussed and published in many papers [1][2][3][4]. Lasers are able to solder and rework components on highly dense circuit boards and limit the heat to specific areas. A laser rework tool was evaluated across a wide variety of printed circuit board assemblies [5][6]. Identical test hardware was then processed on conventional hot-gas rework equipment. Such a comparison was intended to identify applications in which laser-based rework technology may be superior to conventional methods.

The focus of this study was on typical surface mount technology (SMT), pin-through-hole (PTH) and combined applications. With the laser equipment cost approximately twice that of hot-gas [7][8], justification is difficult for such applications. In most cases, hot gas can provide a safe and effective rework method. However, other Solectron sites have found specific applications where the laser tool was required and superior [9][10].

Key words: Laser rework, hot-gas rework, and profile



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