SMTA International Conference Proceedings


LEAD-FREE AND TIN-LEAD REWORK DEVELOPMENT ACTIVITIES WITHIN THE NEMI LEAD-FREE ASSEMBLY AND REWORK PROJECT

Author: Jasbir Bath et al.
Company: Solectron Corporation
Date Published: 9/26/2004   Conference: SMTA International


Abstract: With the upcoming European ROHS legislation and other global movements to lead-free assembly, the NEMI leadfree rework group investigated and developed lead-free rework processes for medium to high-end computer products. The work concentrated on development of leadfree hot air convection rework for PBGA, CBGA, uBGA and lead-free hand soldering rework for TSOP and 2512 chip components on 93mil and 135mil thick test vehicle boards. Lead-free and tin-lead rework profiles along with visual and X-ray inspection will be presented and discussed.

The lead-free and tin-lead rework was completed successfully and test boards were submitted for ATC reliability testing for up to 6,000 cycles from 0°C to 100°C which is ongoing at this time.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819