SMTA International Conference Proceedings


AN INVESTIGATION INTO LEAD-FREE BGA REWORK WITH CONSIDERATION TO PROFILE REQUIREMENTS OF IPC/JEDEC J-STD-020B

Author: Peter Verbiest
Company: Jabil Circuit, Inc.
Date Published: 9/26/2004   Conference: SMTA International


Abstract: One of the major challenges for lead free soldering is the limitation of the maximum allowable component package temperature. This narrows the available process window significantly, especially for a BGA rework process. A study was conducted to see if proper solder joint reflow conditions could be achieved during rework of large lead-free BGA’s while respecting component body qualification profiles specified in the industry standard, IPC/JEDEC J-STD-020B. A target profile was developed based on the upper limit requirements specified in Table 5-2 of the 020B document.

Several thermal profiles were developed and optimized to meet the target profile for two different large BGA’s, on an equipment set that is normally used for tin-lead BGA rework. Solder joint and component body temperatures were simultaneously monitored to observe critical factors such as time above liquidus, ramp rates, peak temperatures as well as temperature differences across the package. Results of this study will be discussed as well as considerations identified for the BGA rework process that may allow for compliance to IPC/JEDEC J-STD-020B.

Key words: large BGA, rework, lead-free, J-STD-020



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