AN INVESTIGATION INTO LEAD-FREE BGA REWORK WITH CONSIDERATION TO PROFILE REQUIREMENTS OF IPC/JEDEC J-STD-020BAuthor: Peter Verbiest
Company: Jabil Circuit, Inc.
Date Published: 9/26/2004 Conference: SMTA International
Several thermal profiles were developed and optimized to meet the target profile for two different large BGA’s, on an equipment set that is normally used for tin-lead BGA rework. Solder joint and component body temperatures were simultaneously monitored to observe critical factors such as time above liquidus, ramp rates, peak temperatures as well as temperature differences across the package. Results of this study will be discussed as well as considerations identified for the BGA rework process that may allow for compliance to IPC/JEDEC J-STD-020B.
Key words: large BGA, rework, lead-free, J-STD-020
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