SMTA International Conference Proceedings


Author: Steve Stach / Mike Bixenman
Company: Austin American Tech / Kyzen
Date Published: 9/26/2004   Conference: SMTA International

Abstract: The cleaning industry is constantly challenged to improve cleaning processes, staying ahead of the ever-advancing technology curve as it applies to new fields of application. Processes are commonly represented as mechanical and chemical energy, temperature and time. With increasing complexity of board and component geometry coupled to more difficult solder paste and flux formulations, cost of ownership concerns reduce the ability of temperature and time to be effective process variables. As a result, mechanical and chemical energy must make up for reduced temperatures and shorter process times.

Typical approaches to increasing mechanical and chemical effectiveness are counter productive for cost of ownership concerns and achieve only diminished returns. New approaches to mechanical energy are introduced in a way to deliver performance at the heart of the residue, rather than the tail of the delivery system. Coupled with new formulations, which are optimized for lower temperatures of operations, new levels of performance, cost modeling, and throughput are achieved simply by answering these following questions with a thoughtful perspective.

What spray configuration is needed at the board level? What type of impingement pressure is needed at the board level? Which is better, high pressure or high flow? All driving towards a single question, is it possible to define a physical equation to determine impingement pressure to penetrate under densely populated components?

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