WHITE RESIDUE FORMATION ON PRINTED CIRCUIT BOARD ASSEMBLIESAuthor: Mulugeta Abtew et al.
Company: Sanmina - SCI Corporation
Date Published: 9/26/2004 Conference: SMTA International
The field failure was successfully duplicated at the factory. Further more, response of both aqueous and no-clean flux to white residue formation was evaluated. Experimental results revealed that solder joints of active devices tend to produce white residue independent of ionic contamination level when both moisture and bias are applied to the site. The combination of experimental results and duplication of the failure at the manufacturing site, indicated that device power up during PCB testing combined with inadequate moisture control were found to be the primary cause of the failure. New testing and device power up schemes were developed and implemented.
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