SMTA International Conference Proceedings


SELECTIVE SOLDER PLATFORM JUSTIFICATION

Authors: David Philips and Jeff Pekas
Company: Daktronics, Inc.
Date Published: 9/26/2004   Conference: SMTA International


Abstract: To justify a selective solder machine on paper is probably the easy task; the difficult task is identifying a selective solder machine that will serve all of your current needs yet provide a flexible platform to respond to the changes in future product designs or market mandates with relative ease.

Some specific issues that require study prior to the purchase of a selective solder machine include: PCB tooling (automatic width adjustment, product specific tooling, or manually adjustable tooling), wetted or non-wetted nozzles, soldering methods to use (drag, dip, mass dip or a combination of all three), flux type, preheat, wave stability, type of product, volume and mix, simulated wave solderingtype tilt action, the size of the soldering chamber, speed and ease of soldering nozzle or plate changes (nozzles, mass dip plates, etc.), ease of programming, simplicity of routine maintenance, and SMEMA compatible. Each of these items will be discussed in detail throughout this document.

Key words: platform, tooling, tilt, nozzles.



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