EFFECT OF SOLDER PASTE AND SURFACE FINISH ON 0201 ASSEMBLY PROCESS DEFECTSAuthors: Rahul A. Newasekar and S. Manian Ramkumar et al.
Company: Rochester Institute of Tech
Date Published: 9/26/2004 Conference: SMTA International
This study discusses in detail the effect of solder paste, board finish, and pad-aperture shape on 0201 assembly process defects, specifically lead-free paste and lead-free surface finishes. To investigate these parameters, a Design of Experiment study was carried out at the Center for Electronics Manufacturing and Assembly at the Rochester Institute of Technology.
Key words: 0201 Assembly, Lead-free solder paste, Leadfree surface finish, Anti-tombstoning paste.
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