SMTA International Conference Proceedings


PCB DESIGN AND ASSEMBLY PROCESS STUDY OF 01005 SIZE PASSIVE COMPONENTS USING LEAD-FREE SOLDER

Author: Fredrik Mattsson et al.
Company: Flextronics
Date Published: 9/26/2004   Conference: SMTA International


Abstract: In the ever growing strive to miniaturize electronic assemblies, the time has come to take another step in the reduction of passive component sizes. Resistors and capacitors can now be produced in the extremely miniaturized 01005 package size; in metric dimensions, this means a length of 400µm and a width of 200µm. In the near future, PCB design and assembly of such components will be a key capability to enable product miniaturization of primarily modules and handheld products.

In this preliminary study, pad and aperture designs, solder paste printing, component placement and reflow soldering for 01005 components will be investigated, based on our previous experience with 0201 size components. Component spacing down to 100 µm is included in the experiments. Shear strength testing, cross-sectioning, and light microscopy as well as Scanning Electronic Microscopy (SEM) are used to examine the results.

Key words: 01005, miniaturization, resistor, capacitor



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