PCB DESIGN AND ASSEMBLY PROCESS STUDY OF 01005 SIZE PASSIVE COMPONENTS USING LEAD-FREE SOLDERAuthor: Fredrik Mattsson et al.
Date Published: 9/26/2004 Conference: SMTA International
In this preliminary study, pad and aperture designs, solder paste printing, component placement and reflow soldering for 01005 components will be investigated, based on our previous experience with 0201 size components. Component spacing down to 100 µm is included in the experiments. Shear strength testing, cross-sectioning, and light microscopy as well as Scanning Electronic Microscopy (SEM) are used to examine the results.
Key words: 01005, miniaturization, resistor, capacitor
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