STENCIL PRINTING SOLDER PASTE AND TRANSFER EFFICIENCY - ESTABLISHING THE BASELINEAuthor: Jeffrey D. Schake / Mark A. Whitmore
Company: DEK USA / DEK UK
Date Published: 9/26/2004 Conference: SMTA International
The experiments performed confirm that paste transfer efficiency performance is significantly influenced by the ratio of surface areas the solder material contacts in the aperture, known as area ratio. Direct comparisons of paste transfer efficiency between square and circular apertures across a broad range of equivalently designed area ratios resulted in similar performance indicate the circle may have the advantage.
Finally, detailed stencil aperture size measurements revealed important discrepancies between designed and actual values that weigh heavily on experimental conclusions and transfer efficiency expectations.
Key words: stencil printing, solder paste, transfer efficiency, area ratio.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.