SMTA International Conference Proceedings


Author: Mike Zimmerman
Company: Quantum Leap Packaging, Inc.
Date Published: 9/26/2004   Conference: SMTA International

Abstract: Quantum Leap Packaging has developed low cost Air Cavity LCP (Liquid Crystal Polymer) packaging for high frequency, power, MEMs and other applications. This unique packaging technology allows for the combination of improved electrical and thermal performance over conventional ceramic packages at much lower costs. Using QLPs proprietary LCP technology, copper flanges and lead frames can be incorporated into the package(along with other metal systems) which can provide for twice the thermal conductivity and a higher electrical conductivity than conventional lead frame and flange materials used in ceramic packaging.

In addition, the packages can meet the same reliability requirements as standard ceramic packages, including passing gross leak and fine leak tests (1 X 10-9 cc/sec). Two lid solutions are also available which include B-stage epoxy, and a unique ultrasonic welding process. In addition, the packages can be provided in strip format, so as to be compatible with conventional automatic assembly operations.

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