JET DISPENSING UNDERFILLS FOR STACKED DIE APPLICATIONSAuthor: Steven J. Adamson
Date Published: 9/26/2004 Conference: SMTA International
This paper will review the state of dispensing for stacked die applications and contrast jetting technology with needle dispensing. It will also offer guidelines for layout rules for Printed Circuit Boards / packages designed to utilize the benefits of jetting technology.
For the last twenty years, dispensing has evolved from pushing fluid through a needle using air pressure, to a highly automated production process with linear positive dispensing pumps and now: jetting. Controlling fluid deposition, needle position and dispensed volume accuracy has dramatically improved in recent years.
Additionally, speed has increased while software has simplified operational control. Jetting underfills and encapsulants is now practical, and it is having a large impact on the electronics assembly.
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