METHODOLOGY FOR PROGNOSTICATION OF ELECTRONICS AND MEMS PACKAGINGAuthors: P. Lall, N. Islam, K. Rahim, J. Suhling
Company: Auburn University
Date Published: 9/26/2004 Conference: SMTA International
In this paper, a methodology for prognostication-ofelectronics has been demonstrated with data of leading indicators of failure for accurate assessment of product damage significantly prior to appearance of any macroindicators of damage. Proxies for leading indicators of failure have been identified. Examples of proxies include - micro-structural evolution characterized by average phase size and correlated to time and equivalent creep strain rate, and stresses at interface of silicon structures. Structures examined include - electronics package, MEMS Package and interconnections. The test vehicle includes packages that have been mounted on a metal backed printed circuit board typical of electronics deployed in harsh environments.
In application environment, the metal-backing provides thermal dissipation, mechanical stability and interconnections reliability. Since, an aged material knows its state the research presented in this paper focuses on enhancing the understanding of material damage to facilitate proper interrogation of material state.
Key words: prognosis, electronics, phase growth.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.