Medical Electronics Symposium Conference Proceedings


Author: Joanna Suresh et al.
Company: North Dakota State University
Date Published: 5/19/2004   Conference: Medical Electronics Symposium

Abstract: This paper examines component packaging and MEMS integrated electronics manufacturing for an implantable bio-medical device. This integrates SMT-MEMS based design for a thermal imaging alternative using a micro heat-sensing grid for certain biomedical applications. The objective of this research was in building a MEMS based bio sensing & monitoring system to detect and monitor peripheral neuropathy/leprosy based injuries relating to nerve function loss in the most vulnerable spots (fingers and feet) and give appropriate indications if preset threshold levels are exceeded.

The design of the proposed system basically comprises of a Temperature Monitoring Device (TMD), which emulates the functionality of the thermograph as it uses thermal sensors to detect increased blood flow in injured sites, and has the added advantage of being portable, compact and cost effective. The paper also tries to address the design challenges that drive the cost for conventional to MEMS technology. LabVIEW* is a graphical programming language which was used for interfacing the external electronics to the computer for a thermal image display. With the results obtained from the conventional system, a MEMS based system is proposed by considering the design considerations for the heat sensing TMD.

This technology can also significantly reduce the real estate for thermal imaging electronic devices, which can explore new MEMS based thermal sensors for several defense applications, which have requirements as stringent to biomedical devices.

Key words: peripheral neuropathy, leprosy, MEMS, flip chip, thermal sensor, LabVIEW, ANSYS.

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