Medical Electronics Symposium Conference Proceedings


Authors: J. Richtsmeier and V. Giovannetti / K. Staller
Company: Sonoscan, Inc. / Medtronic
Date Published: 5/19/2004   Conference: Medical Electronics Symposium

Abstract: Medical microelectronic components, devices and their respective packaging often include multi-laminate structures that are composed of several bond or seal interfaces. Any one of these interfaces can have significant electrical, thermal, mechanical and/or structural importance. What is common and critical to all is the construction of two or more layers that must be sealed or bonded with a specific degree of integrity. The most obvious concern being that even the smallest defect in the seal or bond area (of a medical microelectronic component) could mean possible failure in its functionality and possible risk to a patient’s well being.

Acoustic Micro Imaging (AMI) is a nondestructive inspection technique that utilizes high frequency ultrasound to detect a wide variety of defects or failures within materials (microelectronic components and devices) most typically at the interface between two materials. There are a wide variety of materials within the microelectronic/semiconductor sector that are applicable including polymers, metals, ceramics and composites as well as various bonding agents including epoxies, adhesives, solders and pastes. With source frequencies ranging from 5 to 300 MHz, AMI has the capability to image features/defects as small as 5 to 10 microns in size. The technology can be applied to a variety of component, device, and package configurations including PIC’s, BGA’s, mBGA’s, CSP’s, MEMs, wafers, biochips, flex circuits, thin films, sensors and many more.

Key words: acoustic micro imaging, non-destructive testing, C-SAM, ultrasound, bonding.

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