DEVELOPMENT AND ASSEMBLY OF A CHRONICALLY IMPLANTABLE RETINAL PROSTHESISAuthors: Daniel F. Baldwin, Ph.D., et al.
Company: Engent, Inc.
Date Published: 5/19/2004 Conference: Medical Electronics Symposium
This paper reviews the prosthesis development at the Center for Innovative Visual Rehabilitation and presents the electronics module of the retinal implant including the assembly process used to produce the device. The miniaturized, high-density form factor and biocompatibility of the modules necessitates the use of parylene passivated flex circuitry with a dense circuit pattern. The primary ASIC is mounted using a gold wire stud bumped flip chip interconnect. Chip capacitors and resistors comprise both 0603 and 0402 body sizes. Secondary power and data coils are mounted on the mother flex circuit above the flex-to-flex connection to the stimulating electrode array. In order to ensure high yielding assemblies, a unique fixturing platform has been developed to maintain planarity of the flex circuit during solder paste print, component placement, solder reflow, and interconnect encapsulation.
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