IMPLANTABLE MEDICAL ELECTRONICS ASSEMBLY - QUALITY AND RELIABILITY CONSIDERATIONSAuthors: Peter Borgesen and Eric Cotts
Company: Universal / SUNY Binghamton
Date Published: 5/19/2004 Conference: Medical Electronics Symposium
Depending on materials selection, supplier process control, and contamination these may lead to significant reductions in the resistance to mechanical loads common in service, or possibly even to failure in the absence of a significant load. Underfilling may reduce and/or eliminate the risk of most such failures but introduces alternate risks which must be minimized by optimized materials selection and substrate design.
Key words: packaging, reliability, pacemaker, medical implant.
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