Pan Pacific Symposium Conference Proceedings


Author: Maniam Alagaratnam
Company: LSI Logic
Date Published: 2/10/2004   Conference: Pan Pacific Symposium

Abstract: Increasing demand for higher pin count, improved electrical and thermal performance, and reduced size have made flip chip technology a dominant technology in packaging applications. Laminate substrates are beginning to displace ceramic substrates as the preferred interconnect methodology for flip chip technology due to reduced mass, increased electrical performance, superior board level reliability and a growing supplier base using the established PCB infrastructure.

Flip chip package configuration requires optimum substrate design, wafer bumping, assembly process and material technology. Picking the right bump and assembly technology that is capable of providing high yielding processes with the excellent reliability is a challenge. This paper will review current flip chip manufacturing trends and will provide an update as to roadmap addressing future industry needs.

Key words: flip chip, bumping, organic substrate, roadmap.

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