FLIP CHIP PACKAGING - CURRENT TRENDS AND ROADMAPAuthor: Maniam Alagaratnam
Company: LSI Logic
Date Published: 2/10/2004 Conference: Pan Pacific Symposium
Flip chip package configuration requires optimum substrate design, wafer bumping, assembly process and material technology. Picking the right bump and assembly technology that is capable of providing high yielding processes with the excellent reliability is a challenge. This paper will review current flip chip manufacturing trends and will provide an update as to roadmap addressing future industry needs.
Key words: flip chip, bumping, organic substrate, roadmap.
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