EVALUATION OF THE EFFECTS OF PROCESSING CONDITIONS ON SHEAR STRENGTH AND MICROSTRUCTURE IN PB-FREE SURFACE MOUNT ASSEMBLYAuthors: S. Bukhari, D. Santos, L. Lehman, and E. Cotts
Company: SUNY Binghamton
Date Published: 2/10/2004 Conference: Pan Pacific Symposium
The composition and microstructure of solder joints is characterized as a function of solder joint metallurgy and heat treatment, including reflow schedule and environment, and subsequent annealing treatments. Solder joints evaluated are constructed in ball-on-substrate geometries. The evolution of the microstructure of solder joints is being determined by optical microscopy and scanning electron microscopy.
This data will be correlated with measurements of the mechanical properties of solder joints, namely, the shear strength studies. The need to perform microstructural studies, and to correlate these studies with manufacturability and reliability, has been clearly articulated by many researchers from different organizations (notably, by NEMI). This work directly addresses this need.
Keywords: Pb-free, microstructure, reliability.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.