ELECTROCHEMICAL MIGRATION ON HASL PLATED FR-4 PRINTED CIRCUIT BOARDSAuthor: Elissa Bumiller et al.
Company: Naval Surface Warfare Center
Date Published: 2/10/2004 Conference: Pan Pacific Symposium
It was found that chloride contamination level and electric field influence which failure mechanism is occurring, electrochemical migration or electrolytic corrosion. This study concludes that current industry specifications for cleanliness may be inadequate for the next generation of electronic assemblies.
Key words: electrochemical migration, dendritic growth, electric field, contamination.
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