INDIUM SOLDERING FOR A MOEMS BASED SAFETY AND ARMING DEVICEAuthor: Michael Deeds et al.
Company: Naval Surface Warfare Center
Date Published: 2/10/2004 Conference: Pan Pacific Symposium
The heart of the MOEMS-based S&A is a high aspect ratio MEMS chip fabricated using deep reactive ion etching (DRIE) on silicon on insulator (SOI) substrates. The S&A chip includes environmental sensors, actuators, and optical components. The device directly actuates optical fibers to shutter the firing energy for the explosive train from an out-of-line position (safe) to an in-line position (armed). The chip is housed in a hermetic, organic free clamshell package to provide reliable functionality over its 20-year life.
This paper presents a brief background of the MEMS S&A program and details the associated packaging research with a specific focus on indium soldering for the formation of the hermetically sealed package with optical fiber I/O.
Key words: MOEMS, MEMS, hermetic, indium, solder, fluxless.
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