NOVEL METHODS FOR CREATING STACKED DEVICE STRUCTURES USING MODIFIED STANDARD PACKAGESAuthor: Joseph Fjelstad
Company: Silicon Pipe, Inc.
Date Published: 2/10/2004 Conference: Pan Pacific Symposium
This paper describes novel methods for making stackable package structures from various standard packages, outlining the manufacturing process and exploring circumstances where the methods might be best applied.
Key words: stacked package, package modification.
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