Pan Pacific Symposium Conference Proceedings


NOVEL METHODS FOR CREATING STACKED DEVICE STRUCTURES USING MODIFIED STANDARD PACKAGES

Author: Joseph Fjelstad
Company: Silicon Pipe, Inc.
Date Published: 2/10/2004   Conference: Pan Pacific Symposium


Abstract: IC packaging technology is evolving at a rate that exceeds the ability of the infrastructure to produce and make available all of the wide variety of packages sought by electronic assembly designers. Keeping track of the options in a coherent manner is a significant challenge. In addition, there are significant numbers of legacy chip products that are already produced in packaging that do not conform to the needs of current generation designs.

This paper describes novel methods for making stackable package structures from various standard packages, outlining the manufacturing process and exploring circumstances where the methods might be best applied.

Key words: stacked package, package modification.



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