Pan Pacific Symposium Conference Proceedings


Author: Jim Fraivillig
Company: Fraivillig Technologies
Date Published: 2/10/2004   Conference: Pan Pacific Symposium

Abstract: All-polyimide heat-sealing with our proprietary TPI bond film of copper to aluminum heat sinks convert tough thermal management applications into surface-mount applications. TPI bond film is the basis of products for a range of thermal management electronic packaging formats:

- PowerSiteTM solderable pads enable the solder attachment of discrete power devices, such as a TO-220s or TO-247s, directly to an aluminum heat sink.
- PowerFlexTM technology bonds complex power circuits directly to aluminum heat sinks.
- PowerViaTM thermal columns provide an all-metal thermal connection of PCB SMT-mounted power devices, such as a D2-Paks, to an aluminum heat sink.

These technologies offer improved performance, as well as lower cost over conventional constructions.

Key words: power electronics, thermal management, power device cooling, heat sink mounting, thermal vias.

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