Pan Pacific Symposium Conference Proceedings


SURFACE-MOUNTING OF POWER DEVICES TO ALUMINUM HEAT SINKS

Author: Jim Fraivillig
Company: Fraivillig Technologies
Date Published: 2/10/2004   Conference: Pan Pacific Symposium


Abstract: All-polyimide heat-sealing with our proprietary TPI bond film of copper to aluminum heat sinks convert tough thermal management applications into surface-mount applications. TPI bond film is the basis of products for a range of thermal management electronic packaging formats:

- PowerSiteTM solderable pads enable the solder attachment of discrete power devices, such as a TO-220s or TO-247s, directly to an aluminum heat sink.
- PowerFlexTM technology bonds complex power circuits directly to aluminum heat sinks.
- PowerViaTM thermal columns provide an all-metal thermal connection of PCB SMT-mounted power devices, such as a D2-Paks, to an aluminum heat sink.

These technologies offer improved performance, as well as lower cost over conventional constructions.

Key words: power electronics, thermal management, power device cooling, heat sink mounting, thermal vias.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819