STRUCTURAL FINITE ELEMENTAL MODELING OF A MULTILAYERED PLATED THROUGH-HOLE - EFFECT OF MATERIAL PROPERTIESAuthor: Arun Gowda et al.
Company: SUNY Binghamton
Date Published: 2/10/2004 Conference: Pan Pacific Symposium
In this research, a Finite Element Modeling (FEM) approach using ANSYS simulation software was utilized to study the effect of different PTH build-up material characteristics on the various stresses and displacements within a PTH structure in a 22-layered printed circuit board. The effect of the moduli and coefficients of thermal expansion of the holefill material, the prepreg resin, and the plated copper, on the vertical sidewall stresses within the PTH and the maximum displacement within the PTH was investigated.
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