Pan Pacific Symposium Conference Proceedings


IMBEDDED COMPONENT / DIE TECHNOLOGY: AN INNOVATIVE PACKAGING SOLUTION FOR HIGH RELIABILITY

Author: Casey Hatcher
Company: Soldering Technology Intnl.
Date Published: 2/10/2004   Conference: Pan Pacific Symposium


Abstract: The need for increased reliability coupled with reduced size and weight has demanded the evolution of technology for assembling printed circuit boards. Imbedded Component / Die Technology (IC/DT)(TM) will advance electronics packaging to the next level in the 21st century by transforming 2-Dimensional(2D) component assembly and placement into 3-Dimensions (3D).

Imbedded Component / Die Technology substitutes placement of components on the surface of an organic substrate onto or near a rigid, thermally conductive core utilizing multi-level cavities. The elimination of all external component level packaging further increases reliability by reducing the number of opportunities for electrical and mechanical failure. The use of bare die and thin/thick film components reduces both overall mass/weight and circuit card assembly (CCA) size.

Imbedded Component / Die Technology improves form factor with increased component-to-substrate ratio allowing for smaller CCA's or for the addition of redundant systems to increase reliability for high reliability (Hi-Rel) applications. Flexible interconnects from component-to-component or component-to-substrate, coupled with a vibration-dampening encapsulant, allow for reliable use in high mechanical shock and vibration environments.

Replacing solder as the mechanical and electrical attachment material, conductive adhesives and wire bonds allow for lower overall processing temperatures. The use of Imbedded Component / Die Technology when assembling CCA's can dramatically improve reliability and also improve form factor.

Key words: wire bonds, conductive adhesives, organic substrate, reliability, hi-rel, 3-dimensional, cavities, thermal core, imbedded components, bare die.



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