RELIABILITY AND FAILURE ANALYSIS OF NO-CLEAN FLIP CHIP ASSEMBLYAuthor: Jen-Chieh Chang
Company: Industrial Technology Research
Date Published: 1/25/2000 Conference: Pan Pacific Symposium
The paper discusses the failure mode for thermal cycles of flip chip with eutectic solder interconnect. According to the reliability test result, we can verify the acceptance of used assembly process. For more details, failure mode analysis is made by cross-sections of the failed chips to see what happened in the solder joint.
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