SMTA International Conference Proceedings


CSP ASSEMBLY PROCESS ISSUES AND CHALLENGES

Author: Nicholas Brathwaite
Company: Flextronics International
Date Published: 9/12/1999   Conference: SMTA International


Abstract: Last year, the first CSP test vehicle was designed and process qualification was completed. Since then, newer CSP packages, such as low pin-count CSP and finer pitch CSP, have been developed. A second test vehicle was designed in-house to evaluate the impact of the assembly process. The test vehicle was in PCMCIA card format and was populated with over ten CSP components, including, low pin-count CSP and Integrated Passive CSP from several different suppliers. CSP packages are located on both sides of the PCB. SMT components, including 0402 and 0201 small discrete devices, are placed on the test board. Then, reliability tests are going to be performed on the assembled test vehicles. These tests included thermal shock testing, temperature cycle testing, high temperature storage testing and humidity/temperature testing.

In this study, the issues and challenges of performing CSP reliability testing, including process development, process optimization and key process variables will be discussed.. Statistics will be used to analyze and predict the test vehicle’s reliability, and the data will be summarized and analyzed.. In addition, a design for manufacturability recommendation will be presented.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819