MECHANICAL STRESS CONTROL AND MANAGEMENT IN THE ASSEMBLY PROCESSES FOR Sn-Pb AND Pb-FREE SYSTEM *PHASE I - A METHODOLOGY FOR...Author: Hana Hsu et al.
Company: Mitac International Corp.
Date Published: 2/10/2004 Conference: Pan Pacific Symposium
Strain measurement by strain gage was developed and used in material test for decades. Recent applications on PCB assembly have shown great advantage to monitoring the strain response on PCB surface under mechanical force field. Study of quasi-brittle and instantaneous fracture solder joint under these external loads also raise great interest in the recent electronic industry. In this study, this approach was widely used in the PCB assembly to identify potential risk in various assembly processes, handling, touch-up assembly and mechanical insertion, and testing etc. such that these damaging stress can be reduced or eliminated immediately.
An advanced research methodology will be also proposed to correlate the loading speed and deflection to the ATC reliability scale to further resolve the inadequate understanding of residue stress or permanent displacement under external force field and their relationship to the reliability scale. Above approach was used in existing assembly process in eutectic soldering and will be applied in lead-free process development and control as well.
Key word: BGA, strain gage, SMT, mechanical stress.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.