M3D(TM) TECHNOLOGY MAKES BOND PAD ECOS A SNAPAuthors: Dr. Bruce King and Dr. Marcelino Essien
Company: Optomec, Inc.
Date Published: 2/10/2004 Conference: Pan Pacific Symposium
Even if the design infrastructure were in place, redesign is out of the question. First, the cost associated with taking a designed and tested chip back to the drawing board is prohibitive. Second, there’s the time involved with redesign of an IC. Third, the number of different package styles would require an IC to go through several iterations of design, one for each differing style of package, each with a differing range of interconnects. Fourth, the creation of a new set of mask masters is cost-prohibitive. And finally, by the time the new design is ready for production, the package style probably would have changed - again.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.