Pan Pacific Symposium Conference Proceedings


Authors: Lou Nicholls, Paul Mescher and Dave McCann
Company: Amkor Technology, Inc.
Date Published: 2/10/2004   Conference: Pan Pacific Symposium

Abstract: With the ever increasing capability and speed of home based applications for PCs and gaming the need for high volume flip chip manufacturing at subcontract manufacturers is apparent. With the economies of scale that a subcontractor brings, the challenge is now to migrate from a lower volume, high mix manufacturing environment, to a high volume lower mix manufacturing environment.

This migration involves changing the way of thinking for flip chip manufacturing in order to take advantage of the potential cost savings that high volume production affords, and balancing that with the proper level of flexibility needed to support multiple customers utilizing multiple packaging constructions.

Key words: flip chip, manufacturing, mass production.

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