CONSIDERATIONS IN HIGH VOLUME FLIP CHIP MANUFACTURINGAuthors: Lou Nicholls, Paul Mescher and Dave McCann
Company: Amkor Technology, Inc.
Date Published: 2/10/2004 Conference: Pan Pacific Symposium
This migration involves changing the way of thinking for flip chip manufacturing in order to take advantage of the potential cost savings that high volume production affords, and balancing that with the proper level of flexibility needed to support multiple customers utilizing multiple packaging constructions.
Key words: flip chip, manufacturing, mass production.
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