NO-FLOW UNDERFILL TECHNOLOGY FOR FLIP-CHIP BONDINGAuthors: Akira Ohuchi, Tomoo Murakami, and Tsutomu Kawata
Company: NEC Corporation
Date Published: 2/10/2004 Conference: Pan Pacific Symposium
Exploring the trade-off relation between high reliability and good solder joints, we have improved the outlook for no-flow underfill technology by using a local reflow process and high-temperature or lead-free solder bumps. Reliability tests found no open-circuit or short-circuit failures after 1500 cycles between -40°C and 125°C, and we have also confirmed that this process can provide void-free packaging.
Key Words: flip-chip bonding, no-flow underfill , solder joint, void, fillet crack.
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