TERNARY INTERMETALLIC COMPOUND - A REAL THREAT TO BGA SOLDER JOINT RELIABILITYAuthors: Shelgon Yee, Ph. D., et al.
Company: Solectron (Suzhou) Technology
Date Published: 2/10/2004 Conference: Pan Pacific Symposium
Once this ternary IMC forms a continuous layer, the interface be-comes highly susceptible to fracture under stress. This paper will demonstrate the effect of BGA pad finish on Ni-Cu-Sn ternary IMC growth. Methods for characterizing related solder joint failures and techniques for measuring the strength of the solder joints will also be discussed. Al-though this phenomenon is still not fully understood, it has proven to be a real threat to BGA solder joint reliability.
Key words: BGA, reliability, intermetallic, ternary IMC, SEM/EDX.
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