DESIGN, PERFORMANCE AND RELIABILITY OF FIVE NEW LOW COST THERMALLY ENHANCED BGAAuthors: Tiao Zhou, Ph.D. et al.
Company: STMicroelectronics Inc.
Date Published: 9/21/2003 Conference: SMTA International
The objective is to achieve the best thermal performance with minimum added cost and without using forced air and heat sink. The five new thermally enhanced BGA packages considered in this paper are: 1. C2BGA 2. Metal core BGA 3. Slug LGA 4. Exposed die LGA 5. Spreader LGA
Package design and heat dissipation principles of these new thermally enhanced BGAs are presented. Manufacturing and cost considerations are discussed. Experiment and simulation are performed to compare these five packages against each other and conventional TFBGA on thermal performance and reliability. Material and process are discussed to address the manufacturability and cost of each option.
It is found that C2BGA offers excellent thermal performance with minimum cost.
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