SMTA International Conference Proceedings


EPOXY FLUX BRIDGES THE GAP TO LOW COST NO-CLEAN FLIP CHIP ASSEMBLY

Author: Dr. Wusheng Yin et al.
Company: Indium Corporation of America
Date Published: 9/21/2003   Conference: SMTA International


Abstract: A novel epoxy flux PK-001 is developed and tested for no-clean flip chip attachment processes with tin-lead eutectic solder bumps. Results indicate that soldering and flux residue curing can be accomplished with a single reflow process. PK-001 provides adequate solder wetting and excellent non-voiding behavior for flip chip applications. The latter is attributable to its low volatility at above solder melting temperature.

The uniformity of joint coverage area enables a tight soldering quality control. This is particularly crucial for high I/O count flip chip applications. The thermoset flux residue nature allows a good compatibility with underfills, particularly under high temperature and high humidity conditions. Low ionics content, low corrosivity, and high SIR performance provide the essential remaining properties required for no-clean applications.

Key words: epoxy flux, no-clean, flip chip, soldering, 63Sn37Pb, low cost, underfill, compatibility.



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