REWORK OF BGA/CSP COMPONENTS USING LEAD FREE SOLDERSAuthor: Paul Wood
Date Published: 9/21/2003 Conference: SMTA International
The lead free temperatures will be higher - currently 185° to 235° in the future. This means better control and shorter reflow times are needed. New evaluations will need to be done for lead free manufacturing and rework. The rework cycle is much more difficult than the production cycle.
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