SMTA International Conference Proceedings


REWORK OF BGA/CSP COMPONENTS USING LEAD FREE SOLDERS

Author: Paul Wood
Company: Metcal
Date Published: 9/21/2003   Conference: SMTA International


Abstract: In the event that lead free becomes a popular manufacturing procedure here in the US, many new requirements need to be understood. The world leader on lead free is Japan, and indeed many Japanese companies are now totally lead free already. It is mandatory that the US becomes lead free by 2006 and Europe by 2004 (these dates could be extended out but appears that will not be necessary).

The lead free temperatures will be higher - currently 185° to 235° in the future. This means better control and shorter reflow times are needed. New evaluations will need to be done for lead free manufacturing and rework. The rework cycle is much more difficult than the production cycle.



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