EFFECTS OF THERMAL INTERFACE MATERIAL ON SOLDER JOINT RELIABILITYAuthors: Ross Wilcoxon and Dave Hillman
Company: Rockwell Collins, Inc.
Date Published: 9/21/2003 Conference: SMTA International
The initial levels of this static loading are sufficient to potentially affect the creep behavior of the solder during temperature excursions. Thermal cycle testing of this configuration revealed that package reliability was somewhat reduced when heat sinks with thermal interface materials were used. However, the study also showed that when the components were underfilled, the solder joint reliability was not significantly affected by the use of a heat sink and thermal interface material.
Key words: thermal interface material, PBGA reliability, thermal cycle testing, underfill.
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