SMTA International Conference Proceedings


Authors: Leopold A. Whiteman, Jr.
Company: American Competitiveness Inst.
Date Published: 9/21/2003   Conference: SMTA International

Abstract: The Electronics Miniaturization for Missile Applications (EMMA) Team was assembled to determine, evaluate and mitigate the risks associated with integrating miniaturized commercial electronic packaging technologies into military guided missile systems. The EMMA Team included representation from American Competitiveness Institute (ACI), Raytheon, Rockwell Collins, Naval Surface Warfare Center (NSWC), Marquette University and Georgia Tech Research Institute.

Leaded Surface Mount Technology (SMT), Ball Grid Array (BGA) Technology, Chip Scale Packaging (CSP), and Flip Chip electronic packages were assembled on a customized test vehicle. Design and manufacturing studies were performed to determine the electronic package characteristics in a production environment and thermal cycling and vibration tests were performed to evaluate the reliability. It was concluded that for specific applications, commercial off the shelf (COTS) components could survive hazardous environments requiring high reliability.

The efforts of the EMMA Team resulted in an optimized manufacturing process; a redesign of the Electronic Assembly (EA) Unit within Raytheon’s standard missile, inclusion of COTS advanced electronic packaging, and a complete Technical Applications Guidelines (TAG) handbook, which includes information on how to introduce these technologies into hazardous environments. Furthermore, knowledge gained from the EMMA Program is being applied to current and future Raytheon and Rockwell Collins Programs.

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