INTEGRATING COMMERCIAL OFF THE SHELF PACKAGES (COTS) INTO GUIDED MISSILE SYSTEMS: THE EMMA PROGRAMAuthors: Leopold A. Whiteman, Jr.
Company: American Competitiveness Inst.
Date Published: 9/21/2003 Conference: SMTA International
Leaded Surface Mount Technology (SMT), Ball Grid Array (BGA) Technology, Chip Scale Packaging (CSP), and Flip Chip electronic packages were assembled on a customized test vehicle. Design and manufacturing studies were performed to determine the electronic package characteristics in a production environment and thermal cycling and vibration tests were performed to evaluate the reliability. It was concluded that for specific applications, commercial off the shelf (COTS) components could survive hazardous environments requiring high reliability.
The efforts of the EMMA Team resulted in an optimized manufacturing process; a redesign of the Electronic Assembly (EA) Unit within Raytheon’s standard missile, inclusion of COTS advanced electronic packaging, and a complete Technical Applications Guidelines (TAG) handbook, which includes information on how to introduce these technologies into hazardous environments. Furthermore, knowledge gained from the EMMA Program is being applied to current and future Raytheon and Rockwell Collins Programs.
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