SMTA International Conference Proceedings


BOARD LEVEL ASSEMBLY AND RELIABILITY CONSIDERATIONS FOR QFN TYPE PACKAGES

Authors: Ahmer Syed and WonJoon Kang
Company: Amkor Technology, Inc.
Date Published: 9/21/2003   Conference: SMTA International


Abstract: There is a strong interest in understanding the surface mount assembly requirements of QFN (Quad Flat No-Lead) type packages due to their rapid industry acceptance. Board level reliability is also of great concern as this is a package without compliant leads. This paper provides guidelines in board design and surface mount of this package based on extensive surface mount experiments.

Board level reliability data has also been generated for accelerated temperature cycling test conditions and is presented here. The data is generated for different material sets, various body/die sizes, temperature cycle conditions and board thickness. The data shows reliable surface mount process is achievable and the package is very reliable for most applications.

Key words: QFN, MLF, surface mount assembly, board level reliability, solder joint reliability.



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