BOARD LEVEL ASSEMBLY AND RELIABILITY CONSIDERATIONS FOR QFN TYPE PACKAGESAuthors: Ahmer Syed and WonJoon Kang
Company: Amkor Technology, Inc.
Date Published: 9/21/2003 Conference: SMTA International
Board level reliability data has also been generated for accelerated temperature cycling test conditions and is presented here. The data is generated for different material sets, various body/die sizes, temperature cycle conditions and board thickness. The data shows reliable surface mount process is achievable and the package is very reliable for most applications.
Key words: QFN, MLF, surface mount assembly, board level reliability, solder joint reliability.
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