Pan Pacific Symposium Conference Proceedings


Author: Yoshihiro Yoneda
Company: Fujitsu Media Devices
Date Published: 2/2/1999   Conference: Pan Pacific Symposium

Abstract: A cost-effective Au-solder flip-chip bonding technology working with unique designs of bonding pads and solder resist on organic substrate has been developed. The increasing demand for smaller and lighter system module, and the design requirements for electrical and thermal enhancement drive the deployment of flip chip technologies. Existing flip chip technologies are briefly reviewed and compared; the key design techniques and solder selection to drive the process improvement are explained in details the process improvements include: 1. Excellent void control over underfill resin; 2. Formation of uniform solder humps on the bonding pads of the substrate; 3. Selection of non-lead solder to enhance interconnection reliability. An 5-chip MCM design example is shown for the improvement of bonding time; a test vehicle used for reliability tests is described, the result of reliability tests confirms Au-solder flip chip bonding technique is a sound bonding process.

Key words: Flip Chip, Au-solder, Super Juffit, Build-up

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819