SMTA International Conference Proceedings


MINIATURIZATION USING 3-D STACK STRUCTURE FOR SIP APPLICATIONS

Author: Serguei Stoukatch et al.
Company: IMEC
Date Published: 9/21/2003   Conference: SMTA International


Abstract: The major trend in the packaging industry is to satisfy the needs for high-performance, miniaturized, portable and space-efficient products for mobile equipment, autonomous and wireless telecommunication applications. Since it is becoming more and more difficult to achieve higher density in two dimensions, further increased system density can be realized by growth into the third dimension (Z-axis).

Key words: 3-D packaging, SIP integration, Z-direction stacking concept.



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