SMTA International Conference Proceedings


HOW TO SOLDER NON-STANDARD CBGAs OF 1.0mm PITCH

Authors: Haoqiang Song and Zhe Liu
Company: ZTE Corporation
Date Published: 9/21/2003   Conference: SMTA International


Abstract: With more and more Ceramic Ball Grid Arrays(CBGAs) having been applied in design of optical-electronic products, soldering defects as misregistration.miss soldering.cold soldering happen, especially in some non-standard CBGAs used in modern telecommunication products. The difference between the non-standard and the standard is diameter of solder sphere.

How to eliminate these soldering defects is a difficult work. It involves PWB design, stencil design, mounting program and temperature curve, process control is also very important. Some optimization work to solve these soldering defects of non-standard CBGAs is introduced in this article.

Key words: CBGAs, soldering defects, solder joints.



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