HOW TO SOLDER NON-STANDARD CBGAs OF 1.0mm PITCHAuthors: Haoqiang Song and Zhe Liu
Company: ZTE Corporation
Date Published: 9/21/2003 Conference: SMTA International
How to eliminate these soldering defects is a difficult work. It involves PWB design, stencil design, mounting program and temperature curve, process control is also very important. Some optimization work to solve these soldering defects of non-standard CBGAs is introduced in this article.
Key words: CBGAs, soldering defects, solder joints.
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