SMTA International Conference Proceedings


Author: Richard Snogren
Company: Coretec, Inc.
Date Published: 9/21/2003   Conference: SMTA International

Abstract: This paper presents an emerging technology for embedding ceramic thick-film resistors and capacitors directly into printed circuit boards. Their use frees up surface real estate allowing for smaller boards or for more silicon on the board. They also lower inductance, impedance and radiated emissions. In the past, the technology has been very limited due to lack of component values, performance and availability of commercial materials.

These issues, however, are being eliminated and embedded passives are emerging as a feasible technology. The ceramic thick-film materials are robust and available in a wide range of values. Materials, processes and design guidelines are given. Drivers are performance, miniaturization, and cost.

Key words: embedded passives, ceramic thick films, discrete embedded capacitors, CTF resistors, CTF capacitors.

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