A COMPARATIVE ANALYSIS OF LEAD FREE MATERIALS AND PROCESSES USING DESIGN OF EXPERIMENTS TECHNIQUESAuthor: Sammy Shina et al.
Company: University of Massachusetts
Date Published: 9/21/2003 Conference: SMTA International
A follow-on design of experiments was created in 2002 and a second set of test PWBs with a wide variety of components was manufactured. Several solder pastes based on Sn/Ag/Cu were used with a variety of PWB surface finishes, and reflowed using either air or nitrogen. Visual inspection results have been completed and published, This paper discusses the results of the pull-testing phase of the project. Future work to be completed includes thermal cycling and subsequent pull testing. Results will be published in future papers at electronics conferences.
Key words: lead-free, design of experiments, PWB soldering, solder joint reliability, interchangeability of leaded and lead free components.
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