SMTA International Conference Proceedings


EVALUATION OF WIRE BONDING PERFORMANCE, PROCESS CONDITIONS, AND METALLURGICAL INTEGRITY OF CHIP ON BOARD WIRE BONDS

Authors: Daniel T. Rooney, Ph.D. et al.
Company: Flextronics
Date Published: 9/21/2003   Conference: SMTA International


Abstract: Chip on board wire bonding presents challenges to modern wire bonding technology which include smaller, closely spaced wire bond pads; bonding to soft substrates without special processing and pad construction; and diverse first bond and second bond metallurgies. These challenges are addressed by extensive bonding accuracy tests, a design of experiments approach for optimizing wire bond process parameters, reliability testing, and detailed materials characterization of the metallurgical integrity of the wire bonds.

The thermo-mechanical integrity of the wire bond interconnects was evaluated by wire pull and hot storage tests. The methodology of materials analyses of the metallurgy of the wire bond interconnects is described. The paper illustrates a wire bond lift technique that is used to inspect for cratering damage and the "area-uniformity" of gold aluminum intermetallics. An improved understanding of the wire bonding process was achieved by showing the dependence of the visual appearance of the wire bonds on wire bond process parameters.



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