EVALUATION OF WIRE BONDING PERFORMANCE, PROCESS CONDITIONS, AND METALLURGICAL INTEGRITY OF CHIP ON BOARD WIRE BONDSAuthors: Daniel T. Rooney, Ph.D. et al.
Date Published: 9/21/2003 Conference: SMTA International
The thermo-mechanical integrity of the wire bond interconnects was evaluated by wire pull and hot storage tests. The methodology of materials analyses of the metallurgy of the wire bond interconnects is described. The paper illustrates a wire bond lift technique that is used to inspect for cratering damage and the "area-uniformity" of gold aluminum intermetallics. An improved understanding of the wire bonding process was achieved by showing the dependence of the visual appearance of the wire bonds on wire bond process parameters.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.