SMTA International Conference Proceedings


CONSIDERATIONS IN THE DEVELOPMENT OF AN 0201 COMPONENT ASSEMBLY PROCESS

Authors: Alan Rae, Joe Renda, and Joe Belmonte
Company: Cookson Electronics
Date Published: 9/21/2003   Conference: SMTA International


Abstract: Although the process for using 0201 devices has been in use for a few years, it has always been done under the engineering microscope. In order for this technology to become more prevalent, it needs to be more user-friendly. This session will cover the introduction process and provide an understanding for the attendee companies wishing to minimize their initial risk.

The continuing demand for smaller lighter portable products has driven the use of miniature components. One of the miniature component packages that is being used for resistors and capacitors is the 0201 chip component package. This component is 0.02" (0.5mm) x 0.01" (0.25mm). The 0201 component package is dramatically smaller than the previous smallest component package used for resistors and capacitors, the 0402 (0.04" or 1mm x 0.02" or 0.5mm) component package.



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