BOARD LEVEL RELIABILITY EVALUATIONS OF 40, 32 AND 30 MIL PITCH BALL GRID ARRAY PACKAGES OVER -40 TO 125 C
Authors: Puligandla Viswanadham Company: Raytheon Systems Date Published: 2/2/1999
Pan Pacific Symposium
Abstract: As electronic packaging miniaturization continues, finer pitch ball grid array packages in the form of chip scale packages and micro-ball grid array are making inroads into second level electronic packaging. Board level reliability evaluations of these packages is important to assure their application for commercial as well as military applications. In this paper are reported the assembly process and package to board solder joint reliability assessment of 40, 32 and 30 mil ball grid array packages on a high Tg FR-4 multi-layer test vehicle. A commercially available test vehicle was used for the evaluation of the 30 mil pitch packages. Thermal cycling data was generated in the -40 to 125C temperature range. Test vehicle design, assembly process and parameters used, and the reliability results are discussed. Acceptable thermal cycling reliability for selected applications is demonstrated. Results of the reliability tests and failure modes and mechanisms will be discussed. Keywords: Fine Pitch BGA, Assembly, Reliability, Failure analysis, Thermal Cycling, Micro-type BGA.